Edical May specializes in low-to-medium, high-mix and high-complexity mixed technology.  Specifically, the Edical May team has experience with SMT and Through Hole placement.  In addition, Edical May offers ball grid array (BGA), COB and Flip Chip capabilities. 

We offer assembly and test strategies including the Flying Probe Test, as well as in-circuit and full functional tests.  Finally, the Edical May facility features state-of-the-art equipment with solder paste inspection, AOI and X-ray inspection capabilities.